Akrochem SP-560 Resin

Phenolic Resin 2402 is a high-performance thermosetting synthetic resin. Chemically known as 4-tert-Butylphenol formaldehyde resin, it features 100% lipid solubility as well as excellent resistance to high temperatures and chemical corrosion. This product enjoys widespread application in fields such as rubber vulcanization, adhesives, and anti-corrosion coatings, while also demonstrating significant potential within the realm of emerging materials.     1. Product Introduction Phenolic Resin 2402 belongs to the category of thermosetting phenolic resins and is characterized by its 100% lipid solubility. It is typically synthesized through a polycondensation reaction between p-tert-butylphenol and formaldehyde in the presence of an alkaline catalyst. During the reaction process, an initial addition reaction occurs to form hydroxymethyl-p-tert-butylphenol; subsequently, further polycondensation takes place—either between hydroxymethyl groups or between hydroxymethyl groups and the active hydrogen atoms on the phenol ring—resulting in the formation of resin molecules possessing a specific cross-linked structure. As a specialized phenolic resin for butyl rubber vulcanization, it serves as a vulcanizing agent for butyl rubber, natural rubber, styrene-butadiene rubber (SBR), and silicone rubber; it is particularly well-suited for the vulcanization of butyl rubber.   2. Product Performance It enhances heat resistance and adhesive strength, exhibits minimal deformation, possesses good ductility, and demonstrates low tensile elongation. Characterized by excellent compatibility, it is primarily soluble in aromatic hydrocarbons, aliphatic hydrocarbons, halogenated hydrocarbons, esters, ketones, and tung oil. Heat Resistance: It maintains excellent stability in high-temperature environments, resisting deformation or decomposition, and is suitable for the manufacture of heat-resistant products. Electrical Insulation: It possesses superior electrical insulation properties, making it suitable for the manufacture of electronic components, such as printed circuit boards and integrated circuit encapsulation materials. Chemical Resistance: It exhibits strong resistance to a wide range of chemical substances—including acids, bases, and salts—making it suitable for use in harsh chemical environments. Mechanical Strength: Once cured, the resin possesses high strength and hardness, allowing it to be used in the manufacture of various structural components capable of withstanding specific mechanical loads. Adhesion Performance: It demonstrates excellent adhesion to a variety of materials—including metals, plastics, and wood—and is frequently utilized as a raw material in adhesives to provide reliable bonding effects.   3. Product Specifications Softening Point (Ring and Ball Method): ≥ 90–120°C Hydroxymethyl Content: 9–15% Lipid Solubility (1:2 Tung Oil, 240°C): Completely soluble. Soluble in organic solvents and vegetable oils such as aromatics, alkanes, halogenated hydrocarbons, esters, ketones, and tung oil; insoluble in water; exhibits low solubility in cold ethanol but is partially soluble in hot ethanol. Free Phenol: ≤ 1% Moisture Content: ≤ 1% Ash Content: 0.3% Average Molecular Weight: 500–1000 Relative Density: 1.05   4. Product Applications Phenolic resin 2402 (Akrochem SP-560 Resin) serves as a vulcanizing agent for various rubbers, including butyl rubber, natural rubber, styrene-butadiene rubber (SBR), and butyl-silicone rubber. It is particularly effective for the vulcanization of butyl rubber, enhancing its heat resistance. It exhibits excellent properties such as minimal deformation, superior heat resistance, high tensile strength, and low elongation. It is utilized in the manufacture of heat-resistant butyl rubber products, with a recommended dosage of 5–10 parts. Friction Materials Industry Used in the manufacture of: Automotive brake pads Motorcycle brake blocks Industrial brake linings Clutch facings Its primary functions include: Bonding and reinforcing fibers and fillers Extending wear life Maintaining braking stability at high temperatures Reducing thermal fade Abrasives and Grinding Tools Industry In grinding wheels, cutting discs, and polishing pads, 2402 phenolic resin is widely used as a bonding agent. Advantages: High strength after curing Strong resistance to centrifugal fracture Good cutting stability Resilience against high-speed rotational impact Electrical Insulation Materials Phenolic resin possesses excellent insulating properties and dimensional stability, making it suitable for use in: Switch bases Electrical appliance housings Motor insulation components Laminated board materials It is particularly well-suited for applications in medium-to-high temperature electrical environments. Refractory and Thermal Insulation Materials Model 2402 serves as an inorganic filler binder for use in: Refractory brick binders Thermal insulation boards High-temperature sealing materials Foundry sand core binding systems   5. Processing Recommendations for Phenolic Resin 2402 To ensure optimal performance, the following points should be observed during actual production: Mixing Stage Ensure thorough dispersion of the resin and fillers to enhance product consistency. Temperature Control Excessively high processing temperatures may lead to premature curing, while temperatures that are too low can result in insufficient flow; therefore, an appropriate temperature range should be established based on the specific equipment being used. Storage Conditions It is recommended to store the product in a cool, dry environment to prevent moisture absorption leading to clumping, as well as degradation caused by high temperatures.   Website: www.elephchem.com whatsapp: (+)86 13851435272 E-mail: admin@elephchem.com

Carbon foam, a functional carbonaceous material with a honeycomb structure, not only boasts excellent properties such as low density, high strength, oxidation resistance, and adjustable thermal conductivity, but also boasts excellent processability. Therefore, it can be used as a thermal conductor, insulator, catalyst carrier, biosolidifier, and absorber. It holds broad application prospects in military applications, energy-saving building insulation, chemical catalysis, biological wastewater treatment, and energy. Carbon foam can be sorted into two kinds—one that lets heat pass through easily (thermally conductive) and another that stops heat from passing through (thermally insulating). The difference lies in how much the original carbon material has been turned into graphite. Mesophase pitch and phenolic resin are two typical carbonaceous precursors for producing high- and low-thermal-conductivity carbon foams, respectively. Currently, both thermosetting and thermoplastic phenolic resins are high-quality carbonaceous precursors for producing low-thermal-conductivity carbon foam. Using phenolic resin as the raw material, a phenolic resin foam can be produced by adding a blowing agent and a curing agent and foaming at normal pressure. Carbon foam is then produced by high-temperature carbonization. The compressive strength of this carbon foam is below 0.5 MPa, which restricts how it can be used.   When Phenolic Resin 2402 is used as the raw material, the pores of the carbon foam produced at different foaming pressures are all nearly spherical (Figure 6). Since no foaming agent is added, the foaming process follows a self-foaming mechanism, whereby the matrix material undergoes a cracking reaction at a certain temperature, generating corresponding small molecular gases. As gases form, they gather and grow into pores. The viscosity, structure, volume, shape, and gas production rate of the base material change as cracking gas is produced. This means the structure of pores in carbon foam depends on the base material's viscosity, gas production rate, volume, how quickly its viscosity changes, and outside pressure within the foaming temperature range. At foaming temperatures between 300 and 425°C, 2402 phenolic resin makes lots of cracking gas (Figure 3(a)) and has low viscosity (<2×104Pa·s, Figure 4(d)). Because of this, surface tension causes the pores to be round. When the foaming pressure is 1.0 MPa, the low outside pressure causes bubbles to merge and grow, leading to larger pore sizes (500-800 μm). Also, the larger pores mean the carbon foam has thinner connections and many pores are close to becoming open cells (Figure 6(a)).   When the foaming pressure goes up to 3.5 MPa, the pore size of the carbon foam goes down (300-500 μm), the connections get thicker, and the pore structure is more consistent (Figure 6(b)). If the foaming pressure keeps increasing to 5.0 MPa, the pore size keeps going down, but the consistency of the pore structure starts to get worse (Figure 6(c)). At a foaming pressure of 6.5 MPa, the pore structure of the carbon foam keeps getting worse, but the pore density goes up (Figure 6(d)).   When the foaming temperature goes above 425°C, the viscosity of the 2402 phenolic resin quickly goes up. The foaming pressure clearly has an important impact on how consistent the pore structure is and how dense the carbon foam is. If the foaming pressure is less than the pressure inside the bubble, the cracking gas produced later can still overcome the base material's viscosity and keep gathering and growing in the already formed bubble. This results in a fairly consistent pore structure in the bubble, but no new bubbles will form. But, if the foaming pressure is high enough, the cracking gas produced later can only form new, smaller bubbles at the connections of the already formed bubbles or in the base material, which makes the pore structure of the foamed carbon worse and increases the pore density.   Conclusion (1) The way thermoplastic phenolic resin (resin for refractory) foams is based on its own reaction. How well it foams depends on the conditions (pressure, temperature, and time). It's also influenced by how the molecules interact, considering their size, distribution, how they lose weight when heated, and how their viscosity changes with temperature. Viscosity and temperature are key. (2) When heated to 300-420°C, 2402 Phenoic formaldehyde resin breaks down fast, making a lot of gas. If the material's viscosity is below 2×104 Pa·s at this point, the resulting foamed carbon has good bubbles that are round and evenly spaced. (3) Lower pressures when foaming help make foamed carbon with consistent pores. Higher pressures stop the gas from clumping together and getting bigger, which causes more bubbles to form. This makes the pore structure uneven and increases how many bubbles there are.   Website: www.elephchem.com Whatsapp: (+)86 13851435272 E-mail: admin@elephchem.com

Phenoic formaldehyde resin (PF) are a varied group of synthetic resins produced through the reaction of phenolic compounds and aldehydes. These resins were first noted in the 1870s, with Bayer creating the first synthesis. Later, through continued study, L.H. Baekeland, an American scientist, created a useful phenolic resin system in 1909. He then started the Bakelite Company, which began the industrial production of phenolic resins. These resins are now common in molding compounds, styling products, insulation, coatings, encapsulation materials, and refractory materials.     1.Synthesis of Phenolic Resins   Phenolic resins are made from a variety of raw materials, resulting in varying types and properties. Phenol-formaldehyde resin is the industrial resin people use most. It is created from phenol and formaldehyde using a two-step process involving addition and polycondensation. Depending on the specific material requirements, the reaction process and rate of the addition and polycondensation reactions can be controlled by varying the synthesis process conditions of phenolic resins to produce resins with varying molecular structures, viscosities, solids contents, and residual carbon content.   2. Classification of Phenolic Resins   The molecular structure of phenolic resins can be changed by controlling the synthesis settings. These settings affect the addition and polycondensation reactions. Based on these molecular structures, phenolic resins can be classified as thermoplastic phenolic resins and thermosetting phenolic resins. 2.1 Thermoplastic Phenolic Resin ( Novolac )   Thermoplastic Phenolic Resin (such as Phenolic Resin 2402) are linear phenolic resins characterized by their straight-chain molecular arrangement.They are primarily produced by reacting excess phenol (P) with formaldehyde (F) under acidic conditions. Thermoplastic Phenolic Resin are created through a two-stage reaction: first, an addition reaction, then a polycondensation reaction. Because the reaction takes place in an acidic environment, the addition mostly results in monomethylol groups forming at the ortho and para locations on the benzene ring (see Figure 2). The second stage, polycondensation, mainly involves the dehydration of the produced monomethylolphenol with the phenol monomer. Furthermore, under acidic conditions, the rate of the polycondensation reaction is much faster than the addition reaction. Furthermore, the presence of phenol in the reaction system is greater than that of formaldehyde. This causes the hydroxymethyl groups generated during the addition process to rapidly react with the excess phenol in the system to form linear macromolecules, resulting in the absence of active hydroxymethyl functional groups in the reaction product molecules. The structural formula is shown in Figure 4. 2.2 Thermosetting Phenolic Resin ( Resole )   Thermosetting phenolic resin (such as Phenolic resin for electronic materials) is a relatively reactive intermediate product synthesized by reacting for a certain period of time under the action of an alkaline catalyst and heat at a molar ratio of formaldehyde to phenol greater than 1. Therefore, if the synthesis process is not controlled, it can easily react violently, leading to gelation and even cross-linking reactions, ultimately forming insoluble and infusible macromolecules.   The synthesis process of thermosetting phenolic resin is also divided into two steps. The initial stage involves an addition reaction where hydroxymethyl groups are formed on the benzene ring, specifically at the ortho and para positions, leading to the creation of monomethylolphenol. Because the reaction activity of the active hydrogen atoms at the ortho and para positions on the benzene ring is much greater than that of the hydroxyl group on the hydroxymethyl group under alkaline conditions, the resulting hydroxymethyl group is not easily polycondensed.The active hydrogen atoms on the benzene ring can react with more hydroxymethyl groups, leading to the creation of dimethylol and trimethylolphenol. Figure 5 shows this addition reaction. Next, a polycondensation reaction occurs where the polymethylol groups react with active hydrogen atoms on the phenol monomer. This creates a methine bridge, or the hydroxymethyl groups dehydrate to form an ether bond. As this polycondensation keeps happening, it makes a branched resol phenolic resin.   The curing mechanism of thermosetting phenolic resins is quite complex. Currently, the most widely accepted theory is based on the active hydroxymethyl groups present in the molecular structure of thermosetting phenolic resins. During heating, these hydroxymethyl groups react in two ways: with active hydrogen atoms on the benzene ring to form methylene bonds, or with other hydroxymethyl groups to form ether bonds.   3.The Bonding Mechanism of Phenolic Resins as Binders   Four main ideas exist to explain how polymer adhesives stick things together: mechanical interlocking, diffusion, electronic attraction, and adsorption. For phenolic resin systems, mechanical interlocking is key.   The sticking process for phenolic resins occurs in two steps. At the start, the resin goes into all the small holes and uneven areas on the surface of what it's bonding to. For this to happen, the resin needs to be able to wet the surface well. Next, the phenolic resin hardens. During this process, molecules join together to form a network. This lets the resin molecules get stuck in the holes and uneven spots, creating a strong grip that holds the resin and the surface together tightly.   Website: www.elephchem.com Whatsapp: (+)86 13851435272 E-mail: admin@elephchem.com